Wire sawing technology: A state-of-the-art review
Author:
Publisher
Elsevier BV
Subject
General Engineering
Reference68 articles.
1. 〈http://www.rockwellautomation.com/global/solutions-services/oem/application-profiles.page〉.
2. Wafering of silicon crystals;Möller;Phys Status Solidi A,2006
3. 〈www.dmt-inc.com〉.
4. Modeling stresses of contacts in wire saw slicing of polycrystalline and crystalline ingots: application to silicon wafer production;Li;J Electron Packag ASME Trans,1998
5. Interior stress for axisymmetric abrasive indentation in the free abrasive machining process: slicing silicon wafers with model wire saw;Yang;J Electron Packag ASME Trans,1999
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