Author:
Wang Yan,Song Li-Xing,Liu Jian-Guo,Wang Rui,Zhao Bo-Cheng
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference24 articles.
1. Wire sawing technology: a state-of-the-art review [J];Wu;Precis. Eng.,2016
2. Melkote. Diamond Wire Sawing of Solar Silicon Wafers: A Sustainable Manufacturing Alternative to Loose Abrasive Slurry Sawing [J];Kumar,2018
3. An experimental investigation into soft-pad grinding of wire-sawn silicon wafers [J];Pei;Int. J. Mach. Tool Manufact.,2004
4. 18.88%-efficient Multi-Crystalline Silicon Solar Cells by Combining Cu-Catalyzed Chemical Etching and Post-treatment process[J];Wang,2018
5. Distribution of diamond grains in fixed abrasive wire sawing process [J];Chung;Int. J. Adv. Manuf. Technol.,2014
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