Author:
Peng Bofang,Hou Wenmei,Xu Qixin
Funder
Natural Science Foundation of Shanghai
Subject
Electrical and Electronic Engineering,Physical and Theoretical Chemistry,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference18 articles.
1. Precision depth measurement of through silicon vias (TSVs) on 3D semiconductor packaging process;Jin;Opt. Express,2012
2. M. Puech, et al., Fabrication of 3D packaging TSV using DRIE, in: Synposium on Design, Test, Integration and Packaging of MEMS/MOEMS, 2008.
3. On the Technology and Ecosystem of 3D/TSV Manufacturing;Hummler,2011
4. Khaled Salah, Yehea Ismail, Alaa El-Rouby, Arbitrary Modeling of TSVs for 3D Integrated Circuits.
5. An overview of through-silicon-via technology and manufacturing challenges;Gambino;Microelectron. Eng.,2015
Cited by
10 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献