Three-Dimensional Topography of High-Aspect Ratio Trenches by Sample-Induced Aberration-Compensable Coherence Scanning Interferometry-Reference-Cited by-同舟云学术

Three-Dimensional Topography of High-Aspect Ratio Trenches by Sample-Induced Aberration-Compensable Coherence Scanning Interferometry

Published:2024-02-20 Issue:3 Volume:11 Page:1068-1077
ISSN:2330-4022
Container-title:ACS Photonics
language:en
Short-container-title:ACS Photonics

Author:

Ma Jianqiu¹^ORCID,Yuan Qun¹,Gao Zhishan¹,Huo Xiao¹,Xu Zhiyi¹,Zhang Jiale¹,Fan Xiaoxin¹,Zhu Dan¹,Guo Zhenyan¹,Lei Lihua²,Fu Yunxia²,He Hongtao³,Zhao Lin³

Affiliation:

1. School of Electronic and Optical Engineering, Nanjing University of Science and Technology, Nanjing 210094, China

2. Shanghai Institute of Metrology and Testing Technology, Shanghai 201203, China

3. The 13th Institute of China Electronics Technology Corporation, Shijiazhuang 050051, China

Funder

Natural Science Foundation of Shanghai Municipality

National Key Research and Development Program of China

National Natural Science Foundation of China

Program of Shanghai Academic Research Leader

Publisher

American Chemical Society (ACS)

Link

https://pubs.acs.org/doi/pdf/10.1021/acsphotonics.3c01466

Reference41 articles.

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4. A Hybrid Non-destructive Measuring Method of Three-dimensional Profile of Through Silicon Vias for Realization of Smart Devices

5. GaN-based flip-chip LEDs with highly reflective ITO/DBR p-type and via hole-based n-type contacts for enhanced current spreading and light extraction

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