Predicting the Critical Dimensions of Micron and Sub-micron Structures Using Joint Training Models and Electromagnetic Simulation Tools
Author:
Funder
National Science and Technology Council
Publisher
Springer Science and Business Media LLC
Link
https://link.springer.com/content/pdf/10.1007/s12541-024-00981-1.pdf
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3. Kim, S., Jeon, J., Kim, Y., Sugita, N., & Mitsuishi, M. (2023). Design and assessment of phase-shifting algorithms in optical interferometer. International Journal of Precision Engineering and Manufacturing-Green Technology, 10(2), 611–634.
4. Peng, B., Hou, W., & Xu, Q. (2018). Precision 3D profile in-line measurement of through-silicon via (TSV) based on highfrequency spectrum signals in the pupil plane. Optics Communications, 424, 107–112.
5. Wang, G. G., & Shan, S. (2007). Review of metamodeling techniques in support of engineering design optimization.
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