Author:
Yang Connie,Young Wen-Bin
Subject
Applied Mathematics,Modelling and Simulation
Reference15 articles.
1. Y. Guo, G. Lehmann, T. Driscoll, E. Cotts, A model of the underfill flow process: particle distribution effects, in: Electronic Components and Technology Conference, 1999, pp. 71–76.
2. The effect of solder bump pitch on the underfill flow;Young;IEEE Trans. Adv. Packag.,2002
3. Underfill viscous flow between parallel plates and solder bumps;Young;IEEE Trans. Compon. Packag. Technol.,2002
4. Anisotropic behavior of the capillary action in flip chip underfill;Young;Microelectron. J.,2003
5. Analysis of the flow of encapsulant during underfill encapsulation of flip-chips;Han;IEEE Trans. Compon. Packag. Manuf. Technol. B. Adv. Packag.,1997
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