Characterization of sputter deposited Au/Ni/Al multilayers on Si substrates-Reference-Cited by-同舟云学术

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Characterization of sputter deposited Au/Ni/Al multilayers on Si substrates

Published:2009-08 Issue:1 Volume:84 Page:224-227
ISSN:0042-207X
Container-title:Vacuum
language:en
Short-container-title:Vacuum

Author:

Resnik D.,Vrtačnik D.,Aljančič U.,Možek M.,Zalar A.,Amon S.

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation

Reference5 articles.

1. Interconnecting to aluminum- and copper-based semiconductors (electroless-nickel/gold for solder bumping and wire bonding)

2. Handbook of auger electron spectroscopy;Davis,1976

3. AES depth profiling of thermally treated Al/Si thin-film structures

4. Ion beam mixing of Ni/Al multilayer structure at different temperatures

5. Semiconductor material and device characterization;Schroder,1990

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The formation of heterointerface defects in Au/Cu films on Si substrates under direct current in a vacuum ultraviolet environment;Physical Chemistry Chemical Physics;2016

2. Electron migration behavior of Au/Cu multilayer films on Si substrates under UV radiation;Physical Chemistry Chemical Physics;2015

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