Micro structural study of Ti/Pt/Au contacts to p-InGaAs
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference9 articles.
1. Pt/Ti/p‐In0.53Ga0.47As low‐resistance nonalloyed ohmic contact formed by rapid thermal processing
2. Au/Pt/Ti contacts top‐In0.53Ga0.47As andn‐InP layers formed by a single metallization common step and rapid thermal processing
3. J. Appl. Phys.;Chu,1990
4. Rapid isothermal processing of Pt/Ti contacts to p-type III-V binary and related ternary materials
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