Lateral spread of implanted ion distributions in 6HSiC: simulation

Author:

Morvan E.,Mestres N.,Pascual J.,Flores D.,Vellvehi M.,Rebollo J.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference11 articles.

1. Monte Carlo simulation of two-dimensional implanted dopant distributions at mask edges

2. G. Hobler, H. Potzl, L. Gong, H. Ryssel. Simulation of Semiconductor Devices and Processes, vol.4, W. Fichtner, (Ed.) D. Aemmer—Zurich(Switzerland) Sept. 1991.

3. 3D modeling of ion implantation into crystalline silicon: influence of damage accumulation on dopant profiles

4. E. Morvan et al. Proceedings of the E-MRS 1996 Spring Meeting, Strasbourg, France, pp. J–2.5

5. E. Morvan et al. Proceedings of the E-MRS 1998 Spring Meeting, Strasbourg, France, pp. A–2.

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1. Kick-out diffusion of Al in 4H-SiC: an ab initio study;Journal of Applied Physics;2022-07-07

2. Lateral spreads of ion-implanted Al and P atoms in silicon carbide;Japanese Journal of Applied Physics;2021-04-28

3. Lateral straggling of implanted aluminum in 4H-SiC;Applied Physics Letters;2020-01-06

4. Lateral Straggling of Ion Implantation Distributions in 4H-SiC Investigated by SIMS;Materials Science Forum;2019-07

5. Defects related to electrical doping of 4H-SiC by ion implantation;Materials Science in Semiconductor Processing;2018-05

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