The impact of layer thickness of IMP-deposited tantalum nitride films on integrity of Cu/TaN/SiO2/Si multilayer structure
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference28 articles.
1. Multilevel interconnections for ULSI and GSI era
2. Internal stress minimization in the fabrication of transmissive multilayer x‐ray optics
3. Tantalum as a diffusion barrier between copper and silicon
4. Ta Film Properties for X-Ray Mask Absorbers
5. Chemical-mechanical polishing of copper with oxide and polymer interlevel dielectrics
Cited by 27 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Effects of Current Density on Residual Resistivity Ratio of Electrodeposited Copper Films;CHINA SURF ENG;2021
2. Thin film deposition of Ta, TaN and Ta/TaN bi-layer on Ti and SS316-LVM substrates by RF sputtering;Surface and Coatings Technology;2017-01
3. Ultrathin ZrBxOy films as diffusion barriers in Cu interconnects;Vacuum;2015-09
4. Investigation the Electroplating Behavior of Self Formed CuMn Barrier;Journal of Nanoscience and Nanotechnology;2013-08-01
5. A new field-assisted annealing approach for advanced Cu-Zr Alloy metallization;Electronic Materials Letters;2012-10
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3