Chemical-mechanical polishing of copper with oxide and polymer interlevel dielectrics-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Chemical-mechanical polishing of copper with oxide and polymer interlevel dielectrics

Published:1995-12 Issue:1-2 Volume:270 Page:596-600
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Gutmann Ronald J.,Steigerwald Joseph M.,You Lu,Price David T.,Neirynck Jan,Duquette David J.,Murarka Shyam P.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference14 articles.

1. Inlaid Copper Multilevel Interconnections Using Planarization by Chemical-Mechanical Polishing

2. Materials Issues in Copper Interconnections

3. Copper Etching: New Chemical Approaches

4. Reactive ion etching of copper in SiCl4‐based plasmas

Cited by 58 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Nanoscale-Precision Removal of Copper in Integrated Circuits Based on a Hybrid Process of Plasma Oxidation and Femtosecond Laser Ablation;Micromachines;2021-09-30

2. Experimental and theoretical investigation into surface roughness and residual stress in magnetorheological finishing of OFHC copper;Journal of Materials Processing Technology;2021-02

3. Effect of substrate temperature on the properties of electron beam deposited tantalum films;Thin Solid Films;2013-11

4. BEOL Cu CMP Process Evaluation for Advanced Technology Nodes;Journal of The Electrochemical Society;2013

5. A Post-Si CMP Cleaning Using BDD Film Electrochemical Oxidation;Advanced Materials Research;2013-01

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP