Tantalum as a diffusion barrier between copper and silicon
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.104051
Reference15 articles.
1. Electrical and Metallurgical Characterization of Niobium as a Diffusion Barrier Between Aluminum and Silicon for Integrated Circuit Devices
2. Interfacial reactions between Al and RuO2, MoOxand WNxdiffusion barriers on Si
3. Sputtered W–N diffusion barriers
4. Transition metals in silicon
5. Diffusion barriers in thin films
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