Layer splitting in Si by H+He ion co-implantation: Channeling effect limitation at low energy
Author:
Publisher
Elsevier BV
Subject
Instrumentation,Nuclear and High Energy Physics
Reference12 articles.
1. Silicon on insulator material technology
2. Application of hydrogen ion beams to Silicon On Insulator material technology
3. Efficient production of silicon-on-insulator films by co-implantation of He+ with H+
4. A “smarter-cut” approach to low temperature silicon layer transfer
5. When are blistering or flaking repetitive?
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2. Annealing of hydrogen-induced defects in RF-plasma-treated Si wafers:ex situandin situtransmission electron microscopy studies;Journal of Physics D: Applied Physics;2011-06-30
3. Laser treatment of plasma-hydrogenated silicon wafers for thin layer exfoliation;Journal of Applied Physics;2011-03-15
4. Skin Layer Defects in Si by Optimized Treatment in Hydrogen RF Plasma;Plasma Processes and Polymers;2010-10-18
5. Fabrication and characteristics of novel microelectronic structures fabricated by plasma-based techniques;Surface and Coatings Technology;2007-04
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