A “smarter-cut” approach to low temperature silicon layer transfer
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.120601
Reference7 articles.
1. Silicon on insulator material technology
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3. A lower bound on implant density to induce wafer splitting in forming compliant substrate structures
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5. Layer splitting process in hydrogen-implanted Si, Ge, SiC, and diamond substrates
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