Layer splitting process in hydrogen-implanted Si, Ge, SiC, and diamond substrates
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.118586
Reference5 articles.
1. Silicon on insulator material technology
2. Silicon carbide on insulator formation using the Smart Cut process
3. Diversity and feasibility of direct bonding: a survey of a dedicated optical technology
4. Effects of deuterium plasmas on silicon near‐surface properties
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