Growth, electrical properties and reciprocal lattice mapping characterization of heavily B-doped, highly strained silicon-molecular beam epitaxial structures
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Inorganic Chemistry,Condensed Matter Physics
Reference24 articles.
1. Silicon Germanium Heterobipolar Transistor Structures with Extremely High Base Doping
2. Boron delta doping in Si and Si0.8Ge0.2layers
3. Surface Segregation of Boron During Si-MBE Growth
4. Temperature dependence of incorporation processes during heavy boron doping in silicon molecular beam epitaxy
5. Kinetics of ordered growth of Si on Si(100) at low temperatures
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1. Integration of Highly Strained SiGe in Source and Drain with HK and MG for 22 nm Bulk PMOS Transistors;Nanoscale Research Letters;2017-02-16
2. Electrical and Schottky contact properties of Pt/n‐Si 1– x Ge x /n‐Si(100) heterostructure;physica status solidi (c);2005-03
3. Incorporation of boron in SiGe(C) epitaxial layers grown by reduced pressure chemical vapor deposition;Materials Science in Semiconductor Processing;2005-02
4. Strain and Electrical Characterization of Boron-Doped SiGeC Layers Grown by Chemical Vapor Deposition;Physica Scripta;2004-01-01
5. Formation of Shallow Junctions by HCl-Based Si Etch Followed by Selective Epitaxy of B-Doped Si[sub 1−x]Ge[sub x] in RPCVD;Journal of The Electrochemical Society;2004
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