Author:
Spiering Vincent L.,Bouwstra Siebe,Spiering Ruud M.E.J.
Subject
Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials
Reference15 articles.
1. Microsensor packaging and system partitioning;Senturia;Sensors and Actuators,1988
2. Construction problems in sensors;Vaganov;Sensors and Actuators A,1991
3. Novel stress free assembly technique for micromechanical devices;Offereins;Proc. Micro System Technol. 90, Berlin, Germany,10131990
4. How to liberate integrated sensors from encapsulation stress;Hälg;Sensors and Actuators,1990
5. Mechanical decoupling of monolithic pressure sensors in small plastic encapsulations;Germer;Sensors and Actuators,1990
Cited by
44 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献