Construction problems in sensors-Reference-Cited by-同舟云学术

Construction problems in sensors

Published:1991-08 Issue:3 Volume:28 Page:161-172
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Vaganov Vladimir I.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference67 articles.

1. Classifying solid-state sensors: the sensor effect cube;Middelhoek;Sensors and Actuators,1986

2. General trends and problems of sensoelectronics development and system approach to sensor design, transducers on the basis of microelectronic technology;Vaganov;Proc. Conf. MDNTP, Moscow,1986

3. The packaging of implantable integrated sensor;Bowman;IEEE Trans. Biomed. Eng.,1986

4. Micromachined package for chemical microsensors;Smith;IEEE Trans. Electron Devices,1988

5. Problems of sensor microconstructing, transducers on the basis of microelectronic technology;Vaganov;Proc. Conf. MDNTP, Moscow,1989

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