Mechanical decoupling of monolithic pressure sensors in small plastic encapsulations-Reference-Cited by-同舟云学术

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Mechanical decoupling of monolithic pressure sensors in small plastic encapsulations

Published:1990-04 Issue:1-3 Volume:23 Page:1065-1069
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Germer Wilfried,Kowalski Günter

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference5 articles.

1. Piezoresistive Silizium-Drucksensoren;Binder,1989

2. Miniature pressure sensors and their temperature compensation;Kowalski;Sensors and Actuators,1987

3. Aufbau- und Verbindungstechnik für Sensoren;Reichel;VDI-Ber.,1988

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Capacitive Sensors;Sensors;2008-03-20

2. Surface-micromachined capacitive differential pressure sensor with lithographically defined silicon diaphragm;Journal of Microelectromechanical Systems;1996-06

3. On-chip decoupling zone for package-stress reduction;Sensors and Actuators A: Physical;1993-11

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