Microsensor packaging and system partitioning-Reference-Cited by-同舟云学术

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Microsensor packaging and system partitioning

Published:1988-11 Issue:3 Volume:15 Page:221-234
ISSN:0250-6874
Container-title:Sensors and Actuators
language:en
Short-container-title:Sensors and Actuators

Author:

Senturia Stephen D.,Smith Rosemary L.

Publisher

Elsevier BV

Subject

General Engineering

Reference9 articles.

1. Packaging of implantable electronics: past, present and future developments;Ko,1985

2. The packaging of implantable integrated sensors;Bowman;IEEE Trans. Biomed. Eng., BME-33,1986

3. Silicon as a mechanical material;Petersen;Proc. IEEE,1982

4. Polycrystalline silicon microstructures;Howe,1985

Cited by 27 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Packaging and Reliability Issues in Micro/Nano Systems;Springer Handbook of Nanotechnology;2017

2. Introduction to MEMS Packaging;Microsystems and Nanotechnology;2012

3. Liquid-Phase Packaging of a Glucose Oxidase Solution with Parylene Direct Encapsulation and an Ultraviolet Curing Adhesive Cover for Glucose Sensors;Sensors;2010-06-09

4. Packaging and Reliability Issues in Micro-/Nanosystems;Springer Handbook of Nanotechnology;2010

5. Glass wafers bonding via Diels–Alder reaction at mild temperature;Sensors and Actuators A: Physical;2008-01

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