Study on Adsorption and Complexation Behavior of Thiourea on Copper Surface-Reference-Cited by-同舟云学术

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Study on Adsorption and Complexation Behavior of Thiourea on Copper Surface

Published:2011-09 Issue:9 Volume:6 Page:4048-4058
ISSN:1452-3981
Container-title:International Journal of Electrochemical Science
language:en
Short-container-title:International Journal of Electrochemical Science

Author:

Zhao Jie,Cui Guofeng

Publisher

Elsevier BV

Subject

Electrochemistry

Reference18 articles.

1. Study of Optimized Complexing Agent for Low-Phosphorus Electroless Nickel Plating Bath

2. Surface-enhanced Raman scattering of thiourea adsorbed on the silver electrode: bond polarizability derivatives as elucidated from the Raman intensities

3. Thiourea adsorption on a Pt surface as detected by electrochemical methods and surface-enhanced Raman spectroscopy

4. Cu Bump Interconnections in 20.MU.m-Pitch at Low Temperature Utilizing Electroless Tin-Plating on 3D Stacked LSI.

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1. Recent Recall of Iron Reagent—Investigation of Potential Reagent Contamination and Assay Improvement Strategy;The Journal of Applied Laboratory Medicine;2024-07-24

2. Electroplated Copper Additives for Advanced Packaging: A Review;ACS Omega;2024-05-02

3. Electrochemical and Gravimetric Study on the Corrosion and Corrosion Inhibition of Pure Copper in Sodium Chloride Solutions by Two Azole Derivatives;International Journal of Electrochemical Science;2012-02

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