Electroplated Copper Additives for Advanced Packaging: A Review-Reference-Cited by-同舟云学术

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Electroplated Copper Additives for Advanced Packaging: A Review

Published:2024-05-02 Issue:19 Volume:9 Page:20637-20647
ISSN:2470-1343
Container-title:ACS Omega
language:en
Short-container-title:ACS Omega

Author:

Guo Lanfeng¹²,Li Shaoping³,He Zhaobo²,Fu Yanmei²,Qiu Facheng⁴^ORCID,Liu Renlong¹^ORCID,Yang Guangzhou⁴

Affiliation:

1. School of Chemistry and Chemical Engineering, Chongqing University, Chongqing 400044, China

2. Hubei Sinophorus Electronic Materials Co., Ltd., Hubei 443007, China

3. Hubei Three Gorges Laboratory, Hubei 443007, China

4. College of Chemistry and Chemical Engineering, Chongqing University of Technology, Chongqing 400054, China

Funder

National Key Research and Development Program of China

Fundamental Research Funds for the Central Universities

Hubei Three Gorges Laboratory

Publisher

American Chemical Society (ACS)

Link

https://pubs.acs.org/doi/pdf/10.1021/acsomega.4c01707

Reference39 articles.

1. Copper metallization for advanced IC: requirements and technological solutions

2. Key reliability issues for copper integration in damascene architecture

3. Copper Light-induced Plating Contacts with Ni Seed-layer for mc-Si Solar Cells after Laser Ablation of SiNx:H

4. Electroless copper plating using dimethylamine borane as reductant

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1. Clarifying the mechanism of actions of suppressor, brightener and sodium chloride in acid copper electrodeposition: A multidisciplinary approach for a many variable problem;Journal of Electroanalytical Chemistry;2024-11

2. Surface preparation before chemical copper plating of printed circuit board holes. Part II. Activation;INT J CORROS SCALE I;2024

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