Evaluation of interfacial fracture toughness of a flip-chip package and a bimaterial system by a combined experimental and numerical method

Author:

Wang Jianjun,Zou Daqing,Lu Minfu,Ren Wei,Liu Sheng

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference25 articles.

1. Liu S, Zhu J et al. Investigation of crack propagation in ceramic/adhesive/glass system. IEEE Trans., CHMT, 1995:627–633

2. Liu S, Mei Y et al. Bimaterial interfacial crack growth as a function of mode-mixity. IEEE Trans., CHMT, 1995:618–626

3. Liu S, Mei Y. Behaviors of delaminated plastic IC packages subjected to encapsulation cooling, moisture absorption and wave soldering. IEEE Trans., CHMT, 1995:634–645

4. Liu S. An investigation to popcorning mechanisms for IC plastic packages: defect initiation. Int. J. of Microcircuits and Electronic Packaging, 1997:431–446.

5. The effect of delamination on the thermal deformation of plastic power packages by combined high temperature moiré/FEM approach;Zhu,1996

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