Author:
Wang Jianjun,Zou Daqing,Lu Minfu,Ren Wei,Liu Sheng
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference25 articles.
1. Liu S, Zhu J et al. Investigation of crack propagation in ceramic/adhesive/glass system. IEEE Trans., CHMT, 1995:627–633
2. Liu S, Mei Y et al. Bimaterial interfacial crack growth as a function of mode-mixity. IEEE Trans., CHMT, 1995:618–626
3. Liu S, Mei Y. Behaviors of delaminated plastic IC packages subjected to encapsulation cooling, moisture absorption and wave soldering. IEEE Trans., CHMT, 1995:634–645
4. Liu S. An investigation to popcorning mechanisms for IC plastic packages: defect initiation. Int. J. of Microcircuits and Electronic Packaging, 1997:431–446.
5. The effect of delamination on the thermal deformation of plastic power packages by combined high temperature moiré/FEM approach;Zhu,1996
Cited by
14 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献