Behavior of delaminated plastic IC packages subjected to encapsulation cooling, moisture absorption, and wave soldering
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
General Engineering
Link
http://xplorestaging.ieee.org/ielx4/95/9755/00465163.pdf?arnumber=465163
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5. Molecular Dynamics Investigation of the Thermo-Mechanical Properties of the Moisture Invaded and Cross-Linked Epoxy System;Polymers;2021-12-28
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