Author:
Weide-Zaage Kirsten,Dalleau David,Yu Xiaoying
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference14 articles.
1. Yu X, Weide K. Finite element analysis of thermal–mechanical stress induced failure in interconnects. Frac. & Duc. vs. Brit. Beh.—Theo., Modelling and Experiment. Symp. Boston; 1999.
2. Dalleau D, Weide-Zaage K. 3D time-depending simulation of voids formation in a SWEAT metallization structure. Proceedings of EuroSimE; April 2002.
3. Electromigration in thin film conductors;Lloyd;Semicond Sci Technol,1997
4. Numerical simulation of surface diffusion controlled motion and shape change of electromigration voids;Kraft;Mater Res Soc Symp Proc,1996
5. Dalleau D, Weide-Zaage K. 3D time-depending electro- and thermomigration simulation of metallization structures. Proc. Adv. Met. ULSI App., Conference, San Diego; October 2000.
Cited by
22 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献