Ultrasonic soldering of Cu alloy using Ni-foam/Sn composite interlayer-Reference-Cited by-同舟云学术

Ultrasonic soldering of Cu alloy using Ni-foam/Sn composite interlayer

Published:2018-07 Issue: Volume:45 Page:223-230
ISSN:1350-4177
Container-title:Ultrasonics Sonochemistry
language:en
Short-container-title:Ultrasonics Sonochemistry

Author:

Xiao Yong,Wang Qiwei,Wang Ling,Zeng Xian,Li Mingyu,Wang Ziqi,Zhang Xingyi,Zhu Xiaomeng

Funder

Beijing Science and Technology Planning Project

National Aerospace Science Foundation of China

Natural Science Foundation of Hubei Province

Publisher

Elsevier BV

Subject

Acoustics and Ultrasonics,Radiology, Nuclear Medicine and imaging,Chemical Engineering (miscellaneous),Inorganic Chemistry,Organic Chemistry,Environmental Chemistry

Reference43 articles.

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4. Interfacial intermetallic growth and mechanical properties of carbon nanotubes reinforced Sn3. 5Ag0. 5Cu solder joint under current stressing;Xu;J. Alloys Compd.,2014

5. Effects of Fe 2 NiO 4 nanoparticles addition into lead free Sn–3.0 Ag–0.5 Cu solder pastes on microstructure and mechanical properties after reflow soldering process;Chellvarajoo;Mater. Design,2015

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