Interfacial intermetallic growth and mechanical properties of carbon nanotubes reinforced Sn3.5Ag0.5Cu solder joint under current stressing
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference34 articles.
1. Failure mechanisms of solder interconnects under current stressing in advanced electronic packages
2. Dispersion, interfacial interaction and re-agglomeration of functionalized carbon nanotubes in epoxy composites
3. Effect of CNT decoration with silver nanoparticles on electrical conductivity of CNT-polymer composites
4. .
5. Recent advances on electromigration in very-large-scale-integration of interconnects
Cited by 110 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Nanoparticle-reinforced solder alloys: A comprehensive review of recent formulation properties, and mechanical performance;Journal of Materials Research and Technology;2024-09
2. Taguchi Optimization of Wetting, Thermal and Mechanical Properties of Sn-1.0wt.%Ag-0.5wt.%Cu Alloys Modified with Bi and Sb;Materials;2024-06-01
3. Influence of bismuth addition on the physical and mechanical properties of low silver/lead-free Sn-Ag-Cu solder;Materials Today Communications;2024-06
4. Enhancing performance of Sn–Ag–Cu alloy through germanium additions: Investigating microstructure, thermal characteristics, and mechanical properties;Materials Today Communications;2024-03
5. Electrical Resistivity of Lead-Free Solders Reinforced by Carbon Nanospheres;International Journal of Thermophysics;2024-02-06
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3