Effects of Fe2NiO4 nanoparticles addition into lead free Sn–3.0Ag–0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics,General Mathematics
Reference35 articles.
1. JIS Z 3001, Welding Terms, Japanese Industrial Standard, Japanese Standards Association, 2003.
2. A review: influence of nano particles reinforced on solder alloy;Ervina;Soldering Surface Mount Technol,2013
3. Development of Sn–Zn lead-free solders bearing alloying elements;Zhang;J Mater Sci Mater Electron,2010
4. Thermal and mechanical properties of Sn–Zn–Bi lead-free solder alloys;El-Daly;J Alloys Compd,2009
5. Properties of low melting point Sn–Zn–Bi solders;Zhou;J Alloys Compd,2005
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