Effect of ultrasonic vibration time on the Cu/Sn-Ag-Cu/Cu joint soldered by low-power-high-frequency ultrasonic-assisted reflow soldering-Reference-Cited by-同舟云学术

Effect of ultrasonic vibration time on the Cu/Sn-Ag-Cu/Cu joint soldered by low-power-high-frequency ultrasonic-assisted reflow soldering

Published:2017-01 Issue: Volume:34 Page:616-625
ISSN:1350-4177
Container-title:Ultrasonics Sonochemistry
language:en
Short-container-title:Ultrasonics Sonochemistry

Author:

Tan Ai Ting,Tan Ai Wen,Yusof Farazila

Funder

Ministry of Higher Education, Malaysia

Ministry of Science, Technology & Innovation, Malaysia

Publisher

Elsevier BV

Subject

Acoustics and Ultrasonics,Radiology, Nuclear Medicine and imaging,Chemical Engineering (miscellaneous),Inorganic Chemistry,Organic Chemistry,Environmental Chemistry

Reference26 articles.

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