The wetting behavior of Al/Sn under ultrasonic action
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Mechanics of Materials,General Materials Science
Reference24 articles.
1. Mechanism of ultrasonic-assisted transient liquid phase bonding of 6061 Al alloy with cladded Zn-Al alloy in air;Jia;J. Mater. Process. Technol.,2020
2. Rapid ultrasonic-assisted soldering of AZ31B Mg alloy/6061 Al alloy with low-melting-point Sn–x Zn solders without flux in air;Lai;Acta Metall. Sinica,2019
3. Non-interfacial growth of Cu3Sn in Cu/Sn/Cu joints during ultrasonic-assisted transient liquid phase soldering process;Zhao;Mater. Lett,2017
4. Effect of ultrasonic vibration time on the Cu/Sn-Ag-Cu/Cu joint soldered by low-power-high-frequency ultrasonic-assisted reflow soldering, Ultrason;Tan;Sonochem.,2017
5. Vibration characteristics of aluminum surface subjected to ultrasonic waves and their effect on wetting behavior of solder droplets;Ma;Ultrason.,2014
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Study on the wettability of Sn/Cu system under ultrasonic vibration;Materials Today Communications;2024-08
2. Manufacturing high-strength and corrosion-resistant 6063Al joints by an ultrasonic-assisted liquid and solid phase diffusion technology;Materials Today Communications;2024-06
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