Barrier properties of thin Au/Ni–P under bump metallization for Sn–3.5Ag solder
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry
Reference15 articles.
1. Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology
2. Morphology of interfacial reaction between lead-free solders and electroless Ni–P under bump metallization
3. Effect of reaction time and P content on mechanical strength of the interface formed between eutectic Sn–Ag solder and Au/electroless Ni(P)/Cu bond pad
4. International Technology Roadmap for Semiconductors (Assembly and Packaging),2001
5. Intermetallic structure of laser reflowed Cu/Pb‐Sn solder joints
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