Study of interfacial adhesion energy of multilayered ULSI thin film structures using four-point bending test-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Study of interfacial adhesion energy of multilayered ULSI thin film structures using four-point bending test

Published:2005-08 Issue:1-3 Volume:198 Page:85-89
ISSN:0257-8972
Container-title:Surface and Coatings Technology
language:en
Short-container-title:Surface and Coatings Technology

Author:

Gan Zhenghao,Mhaisalkar S.G.,Chen Zhong,Zhang Sam,Chen Zhe,Prasad K.

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Reference15 articles.

1. Relationship between interfacial adhesion and electromigration in Cu metallization

2. Characterization of tetra methyl cyclo tetra siloxanes-based low-k dielectric film

3. Dielectric/metal sidewall diffusion barrier for Cu/porous ultralow-k interconnect technology

4. The thermomechanical integrity of thin films and multilayers

5. A Test Specimen for Determining the Fracture Resistance of Bimaterial Interfaces

Cited by 30 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Rolling Contact Fatigue and Thermal Spraying Technique;Advanced Topics in Science and Technology in China;2024

2. Failure Process Observation and Failure Mechanism of Ni‐Coated TC4 Alloy by Gradually Changed Curvature Bending Method;Advanced Engineering Materials;2021-09-30

3. Numerical simulation of peel test for ductile thin film along ceramic substrate: Elasto-plastic analysis;Journal of Mechanical Engineering and Sciences;2021-03-08

4. Adhesion evaluation of thin films to dielectrics in multilayer stacks: A comparison of four-point bending and stressed overlayer technique.;Materials & Design;2021-02

5. Interfacial adhesion of alumina thin films over the full compositional range of ternary fcc alloy films: A combinatorial nanoindentation study;Materials & Design;2020-08

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3