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Adhesion evaluation of thin films to dielectrics in multilayer stacks: A comparison of four-point bending and stressed overlayer technique.

  • Published:2021-02 Issue: Volume:200 Page:109451
  • ISSN:0264-1275
  • Container-title:Materials & Design
  • language:en
  • Short-container-title:Materials & Design

Author:

Lassnig A.,Putz B.,Hirn S.,Többens D.M.,Mitterer C.,Cordill M.J.

Funder

Helmholtz-Zentrum Berlin für Materialien und Energie

Horizon 2020

Austrian Science Fund

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference48 articles.

1. Adhesion measurement of thin films;Mittal;Electrocompon. Sci. Technol.,1976

2. Adhesion Measurements of Films and Coatings;Mittal,1995

3. An X-ray study on the mechanical effects of the peel test in a cu/Cr/polyimide system;Park;Acta Mater.,1998

4. A test specimen for determining the fracture resistance of bimaterial interfaces;Charalambides;J. Appl. Mech. Trans. ASME.,1989

5. Quantitative measurement of interface fracture energy in multi-layer thin film structures;Ma;Mater. Res. Soc. Symp. Proc.,1995

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