Author:
Jung Hyun-Woo,Kim Seung-Jae,Kim Yun-Jae,Kim Jung-Yup,Lee Joo-Yul,Park Jun-Hyub
Funder
National Research Foundation
NRF
MSIP
Tongmyong University Research Grants 2017
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering,Mechanics of Materials,General Materials Science,Modeling and Simulation
Reference18 articles.
1. Mann WR, Taber FL, Seitzer PW, Broz JJ. The leading edge of production wafer probe test technology. In: Proceedings of the international test conference; 2004 Oct 26–28, Charlotte, USA. New York: IEEE; 2005.
2. Marinissen EJ. Challenges and emerging solutions in testing TSV-based 2 1/2D- and 3D-stacked ICs. In: Proceedings of the conference on design, automation and test in Europe; 2012 Mar 12–16, Dresden, Germany. New York: The Association for Computing Machinery; 2012.
3. MEMS vertical probe cards with ultra-densely arrayed metal probes for wafer-level IC testing;Wang;J Microelectromechanical Syst,2009
4. A predictive model for wafer probe burn phenomenon;Zafer;Appl Therm Eng,2016
5. A new probe design combining finite element method and optimization used for vertical probe card in wafer probing;Chiu;Precis Eng,2009
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