Author:
Benabou L.,Sun Z.,Dahoo P.R.
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering,Mechanics of Materials,General Materials Science,Modeling and Simulation
Reference45 articles.
1. Selected failure mechanisms of modern power modules;Ciappa;Microelectron Reliab,2002
2. Reliability model for Al wire bonds subjected to heel crack failures;Ramminger;Microelectron Reliab,2000
3. Investigation of the heel crack mechanism in Al connections for power electronics modules;Celnikier;Microelectron Reliab,2011
4. Manson SS. Behavior of materials under conditions of thermal stress. Technical report TN 2933, NACA; 1953.
5. A study of the effects of cyclic thermal stresses on a ductile metal;Coffin;Trans ASME,1954
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