Author:
Ramminger S.,Seliger N.,Wachutka G.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference5 articles.
1. Wirebond Reliability in IGBT-Power Modules: Application of High Resolution Strain and Temperature Mapping;Mehrotra,1999
2. Advanced IGBT modules for railway traction applications: Reliability testing;Berg;Microelectr. Reliab.,1998
3. Thermo-Mechanical Simulation of Wire Bonding Joints in Power Modules;Ramminger,1999
4. Crack Mechanism in Wire Bonding Joints;Ramminger,1998
5. A Numerical and Experimental Study of Temperature Cycle Wire Bond Failure;Chidambaram,1991
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