Stress–temperature behavior of unpassivated thin copper films
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference29 articles.
1. Mechanical properties of thin films
2. Measurement and Interpretation of stress in aluminum-based metallization as a function of thermal history
3. Deformation mechanisms of Al films on oxidized Si wafers
4. Measurement and interpretation of stress in copper films as a function of thermal history
5. Stress development and relaxation in copper films during thermal cycling
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