Subject
Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference40 articles.
1. Cramming more components onto integrated circuits;Moore;Electronics (Basel),1965
2. Overview of dual-active-bridge isolated bidirectional DC-DC converter for high-frequency-link power-conversion system;Zhao;IEEE Trans. Power Electron.,2014
3. Deposition and Structure;Ohring,2002
4. A reliable technology concept for active power cycling to extreme temperatures;Nelhiebel;Microelectron. Reliab.,2011
5. Last metal copper metallization for power devices;Robi;IEEE Trans. Semicond. Manuf.,2008
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