Adhesion–delamination phenomena at the interfaces of the dielectric layer-Reference-Cited by-同舟云学术

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Adhesion–delamination phenomena at the interfaces of the dielectric layer

Published:2020-09 Issue: Volume:18 Page:103249
ISSN:2211-3797
Container-title:Results in Physics
language:en
Short-container-title:Results in Physics

Author:

Pan C.T.,Wu C.N.,Mao S.W.,Wang S.Y.,Ju S.P.,Wu J.D.,Yen C.K.,Chen W.F.

Funder

ASE Technology Holding, Co., Ltd

Ministry of Science and Technology of Taiwan

Publisher

Elsevier BV

Subject

General Physics and Astronomy

Reference18 articles.

1. Board level reliability of PBGA using flex substrate;Hung;Microelectron Reliab,2001

2. Rendering hydrophilic glass-ceramic enamel surfaces hydrophobic by acid etching and surface silanization for heat transfer applications;Nguyen;Surf Coat Technol,2019

3. Hydrophilic and antibacterial surface functionalization of polyamide fabric by coating with polylysine biomolecule;Zhang;Prog Org Coat,2020

4. Enhancing adhesion performance of sputtering Ti/Cu film on pretreated composite prepreg for stacking structure of IC substrates;Chen;Compos B,2019

5. Plasma-assisted synthesis and surface modification of electrode materials for renewable energy;Dou;Adv. Mater.,2018

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