Novel polyimides with improved adhesion to smooth copper and low coefficient of thermal expansion-Reference-Cited by-同舟云学术

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Novel polyimides with improved adhesion to smooth copper and low coefficient of thermal expansion

Published:2023-10 Issue: Volume:285 Page:126388
ISSN:0032-3861
Container-title:Polymer
language:en
Short-container-title:Polymer

Author:

He Zimeng,Huang Shan,Lv Xialei,Li Jinhui,Zhang Guoping,Sun Rong

Funder

National Natural Science Foundation of China

Shenzhen Institutes of Advanced Technology Innovation Program for Excellent Young Researchers

Basic and Applied Basic Research Foundation of Guangdong Province

Publisher

Elsevier BV

Subject

Polymers and Plastics,Materials Chemistry,Organic Chemistry

Reference52 articles.

1. Emerging challenges and materials for thermal management of electronics;Moore;Mater. Today,2014

2. Design and optimization of thermo-mechanical reliability in wafer level packaging;Fan;Microelectron. Reliab.,2010

3. Recent progress of photosensitive polyimides;Fukukawa;Polym. J.,2008

4. Recent progress in aromatic polyimide dielectrics for organic electronic devices and circuits;Ji;Adv. Mater.,2019

5. Advanced polyimide materials: syntheses, physical properties and applications;Liaw;Prog. Polym. Sci.,2012

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