Enhancing adhesion performance of sputtering Ti/Cu film on pretreated composite prepreg for stacking structure of IC substrates-Reference-Cited by-同舟云学术

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Enhancing adhesion performance of sputtering Ti/Cu film on pretreated composite prepreg for stacking structure of IC substrates

Published:2019-02 Issue: Volume:158 Page:400-405
ISSN:1359-8368
Container-title:Composites Part B: Engineering
language:en
Short-container-title:Composites Part B: Engineering

Author:

Chen Yuanming,Chen Yunzhao,Wang Jinzhong,Zhu Kai,Jia Liping,Wang Shouxu,He Wei,Chen Qingguo,Miao Hua,Zhou Jinqun

Funder

National Science Foundation of China

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering,Mechanics of Materials,Ceramics and Composites

Reference30 articles.

1. Core@double-shell structured magnetic halloysite nanotube nano-hybrid as efficient recyclable adsorbent for methylene blue removal;Wan;Chem Eng J,2017

2. Enhancing inductance of spiral copper inductor with BaFe 12 O 19/poly (phenylene oxide) composite as an embedded magnetic core;He;Compos B Eng,2018

3. Design of durable and efficient poly(arylene ether nitrile)/bioinspired polydopamine coated graphene oxide nanofibrous composite membrane for anionic dyes separation;Zhan;Chem Eng J,2018

4. In situ intercalation polymerization approach to polyamide-6/graphite nanoflakes for enhanced thermal conductivity;Meng;Compos B Eng,2017

5. Fabrication of silver electrically conductive adhesive to apply in through-hole filling for PCB interconnection;Zhou;J Mater Sci Mater Electron,2016

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1. Effect of Hydroxyl Group Concentration Generated by Vacuum Ultraviolet Light on the Adhesion Between Epoxy Resin and Copper;Journal of Electronic Materials;2024-09-04

2. Influence Mechanism of Synergistic Additives on the Nucleation and Coating Morphology and Structure of Copper Electronic Plating;CHEM J CHINESE U;2024

3. An adhesion promoter layer for high-frequency printed circuit boards (PCBs) via initiated chemical vapor deposition;Materials Today Communications;2024-08

4. Adhesion improvement of sputtered Cu films on flexible polymer substrates through the design of metal interlayers;Physica Scripta;2024-06-06

5. Comparison of vacuum ultraviolet irradiation and oxygen plasma treatment as pretreatment for copper seed layer on cycloolefin polymer;Japanese Journal of Applied Physics;2024-05-01

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