Electrochemical behavior of a lead-free Sn–Cu solder alloy in NaCl solution
Author:
Publisher
Elsevier BV
Subject
General Materials Science,General Chemical Engineering,General Chemistry
Reference45 articles.
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4. Mechanical properties of Sn–Zn lead-free solder alloys based on the microstructure array;Garcia;Mater. Charact.,2010
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1. Influence of alloying elements on microstructure, mechanical properties and corrosion behaviour of hypoeutectic Sn-6.5wt%Zn-0.5 wt%X (X = Ag, Al, Cu) lead-free solders;Journal of Materials Science: Materials in Electronics;2024-08
2. Predictive model of corrosion kinetics for lead-free solder in polyvinyl chloride fire smoke environment;Transactions of Nonferrous Metals Society of China;2024-07
3. The Influence of Reflowing Process on Electrodeposited Sn-Cu-Ni Lead-Free Solder Alloy;Materials;2024-02-23
4. Electrodeposited Sn-Cu-Ni alloys as lead-free solders on copper substrate using deep eutectic solvents: The influence of electrodeposition mode on the morphology, composition and corrosion behaviour;Surface and Coatings Technology;2024-02
5. Electrochemical corrosion behaviour of Zn-Sn-Cu-xNi lead-free solder alloys;Transactions of Nonferrous Metals Society of China;2023-09
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