The Influence of Reflowing Process on Electrodeposited Sn-Cu-Ni Lead-Free Solder Alloy-Reference-Cited by-同舟云学术

The Influence of Reflowing Process on Electrodeposited Sn-Cu-Ni Lead-Free Solder Alloy

Published:2024-02-23 Issue:5 Volume:17 Page:1034
ISSN:1996-1944
Container-title:Materials
language:en
Short-container-title:Materials

Author:

State (Rosoiu) Sabrina Patricia¹²³^ORCID,Costovici Stefania³,Enachescu Marius³^ORCID,Visan Teodor³,Anicai Liana³^ORCID

Affiliation:

1. Faculty of Medical Engineering, National University for Science and Technology Politehnica Bucharest, 1-7 Gheorghe Polizu Street, 011061 Bucharest, Romania

2. National Institute for Research and Development in Microtechnologies—IMT Bucharest, 126A Erou Iancu Nicolae, 077190 Bucharest, Romania

3. Center of Surface Science and Nanotechnology, National University for Science and Technology Politehnica Bucharest, Splaiul Independentei 313, 060042 Bucharest, Romania

Abstract

Sn-Cu-Ni lead-free solder alloy electrodeposited on copper substrate from a deep eutectic solvent (DES)-based electrolyte under direct current (DC) and pulsed current (PC) was subjected to a reflowing process at the industrial company MIBATRON S.R.L. (Otopeni, Romania). The alteration of the alloy’s composition and anti-corrosive properties upon exposure to the reflow process were investigated via Scanning Electron Microscopy (SEM-EDX), X-ray diffraction (XRD), linear sweep voltammetry (LSV) and electrochemical impedance spectroscopy (EIS). Corrosion studies conducted in sodium chloride solution revealed that the system obtained under the DC plating mode (Sn-Cu-Ni-DC) exhibited enhanced anti-corrosive properties compared to the system obtained under PC (Sn-Cu-Ni-PC) after reflowing. However, prior to reflowing, the opposite effect was observed, with Sn-Cu-Ni-PC showing improved anti-corrosive properties. These changes in anti-corrosive behavior were attributed to the modification of the alloy’s composition during the reflowing process.

Funder

MARIE SKŁODOWSKA-CURIE

NOVTINALBEST

PubArt Program

Publisher

MDPI AG

Link

https://www.mdpi.com/1996-1944/17/5/1034/pdf

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