Electrochemical corrosion behaviour of Zn-Sn-Cu-xNi lead-free solder alloys
Author:
Funder
National Natural Science Foundation of China
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Geotechnical Engineering and Engineering Geology,Condensed Matter Physics
Reference29 articles.
1. Effects of Ni modified MWCNTs on the microstructural evolution and shear strength of Sn–3.0Ag–0.5Cu composite solder joints [J];WANG;Materials Characterization,2020
2. Quasi-in-situ observation on diffusion anisotropy dominated asymmetrical growth of Cu–Sn IMCs under temperature gradient [J];QIAO;Acta Materialia,2021
3. Effect of Co addition into Ni film on shear strength of solder/Ni/Cu system: Experimental and theoretical investigations [J];BI;Materials Science and Engineering A,2020
4. Ball impact reliability of Zn–Sn high-temperature solder joints bonded with different substrates [J];SONG;Journal of Electronic Materials,2013
5. The effects of Cu alloying on the microstructure and mechanical properties of Zn–25Sn–xCu (x=–0–1.0–wt.%) high temperature Pb-free solders [J];GUO;Materials Science and Engineering A,2019
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