Effect of current load on corrosion induced tin whisker growth from SnAgCu solder alloys
Author:
Publisher
Elsevier BV
Subject
General Materials Science,General Chemical Engineering,General Chemistry
Reference30 articles.
1. Tin whisker growth from micro-alloyed SAC solders in corrosive climate;Illés;J. Alloys Comp.,2014
2. The effect of electrolyte layer thickness on electrochemical migration of tin;Zhong;Corros. Sci.,2015
3. Microstructure and elemental composition of electrochemically formed dendrites on lead-free micro-alloyed low Ag solder alloys used in electronics;Medgyes;Corros. Sci.,2015
4. Reliability investigation of low silver content micro-alloyed SAC solders;Krammer;Proceedings of 35th International Spring Seminar on Electronics Technology,2012
5. Microalloying of alloys of the Sn–Ag–Cu system;Perevezentsev;Metal Sci. Heat Treat.,2009
Cited by 19 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Corrosion problems of SAC-SiC composite solder alloys;Corrosion Science;2023-11
2. Incorporation and corrosion protection mechanism of TiO2 nano-particles in SnAgCu composite alloys: Experimental and density functional theory study;Ceramics International;2023-07
3. Selective etching of lead-free solder alloys: A brief review;Materials Today Communications;2022-12
4. Structure and properties of low-Ag SAC solders for electronic packaging;Journal of Materials Science: Materials in Electronics;2022-09-24
5. Suppression of Sn whisker growth from SnAgCu solder alloy with TiO2 and ZnO reinforcement nano-particles by increasing the corrosion resistance of the composite alloy;Journal of Materials Research and Technology;2022-09
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3