Incorporation and corrosion protection mechanism of TiO2 nano-particles in SnAgCu composite alloys: Experimental and density functional theory study
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Surfaces, Coatings and Films,Process Chemistry and Technology,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference46 articles.
1. Microstructure transformation and mechanical properties of Al alloy joints soldered with Ni-Cu foam/Sn-3.0Ag-0.5Cu (SAC305) composite solder;Xiong;J. Alloys Compd.,2022
2. Investigating the thermomechanical properties and intermetallic layer formation of Bi micro-alloyed low-Ag content solders;Krammer;J. Alloys Compd.,2015
3. Sn whisker growth on Sn plating with or without surface treatment during the room temperature exposure;Kim;J. Alloys Compd.,2013
4. The effect of electroplating parameters and substrate material on tin whisker formation;Ashworth;Microelectron. Reliab.,2015
5. Thermal analysis and mechanical properties of Sn–1.0 Ag–0.5 Cu solder alloy after modification with SiC nano-sized particles;El-Daly;J. Mater. Sci. Mater. Electron.,2013
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