Parameter extraction method for Cauer model considering dynamic thermal diffusion boundaries in IGBT module
Author:
Funder
Tianjin Municipal Science and Technology Bureau
Tianjin Science and Technology Program
Publisher
Elsevier BV
Subject
General Engineering
Reference17 articles.
1. Single-event burnout hardening of RC-IGBT with the raised N-buffer layer;Zhang;Microelectron. Reliab.,2022
2. Bond wire lift-off monitoring based on intersection point movement characteristic in IGBT module;Du;Microelectron. J.,2021
3. A high-precision adaptive thermal network model for monitoring of temperature variations in insulated gate bipolar transistor (IGBT) modules;An;Energies,2018
4. Estimation and measurement of junction temperatures in a three-level voltage source converter;Brückner,2005
5. Experimental validation of a thermal modelling method dedicated to multichip power modules in operating conditions;Carubelli;Microelectron. J.,2003
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Development of a steady state electrothermal cosimulation model of SiC power modules;International Journal of Heat and Mass Transfer;2024-07
2. An Online Thermal Parameter Identification Method for MOSFETs in DC-DC converters;2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia);2024-05-17
3. An 800V ultra-low loss field-stop insulated gate bipolar transistor with extended polysilicon gate structure;Microelectronics Journal;2024-01
4. Equivalent circuit model of GaN high electron mobility transistor with consideration of non-ideal effects using genetic algorithm;Journal of Physics D: Applied Physics;2023-06-20
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3