Author:
Launay S.,Fedorov A.G.,Joshi Y.,Cao A.,Ajayan P.M.
Reference14 articles.
1. Thermal issues in next generation integrated circuits;Gurrum;IEEE Transactions on Device and Materials Reliability,2004
2. The evolution of enhanced surface geometries for nucleate boiling;Webb;Heat Transfer Engineering,1981
3. W. Nakayama, T. Nakajima, S. Hirasawa, Heat sink studs having enhancement boiling surfaces for cooling microelectronic components, ASME Paper, 84-WA/HT-89, (1984).
4. Pool boiling heat transfer from plain and microporous, square pin-finned surfaces in saturated FC-72;Rainey;Journal of Heat Transfer,2000
5. Advances in enhancement boiling heat transfer from electronic components;Honda;JSME International Journal,2003
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