Hybrid micro-nano structured thermal interfaces for pool boiling heat transfer enhancement

Author:

Launay S.,Fedorov A.G.,Joshi Y.,Cao A.,Ajayan P.M.

Publisher

Elsevier BV

Subject

General Engineering

Reference14 articles.

1. Thermal issues in next generation integrated circuits;Gurrum;IEEE Transactions on Device and Materials Reliability,2004

2. The evolution of enhanced surface geometries for nucleate boiling;Webb;Heat Transfer Engineering,1981

3. W. Nakayama, T. Nakajima, S. Hirasawa, Heat sink studs having enhancement boiling surfaces for cooling microelectronic components, ASME Paper, 84-WA/HT-89, (1984).

4. Pool boiling heat transfer from plain and microporous, square pin-finned surfaces in saturated FC-72;Rainey;Journal of Heat Transfer,2000

5. Advances in enhancement boiling heat transfer from electronic components;Honda;JSME International Journal,2003

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