Review of jet impingement cooling of electronic devices: Emerging role of surface engineering-Reference-Cited by-同舟云学术

Review of jet impingement cooling of electronic devices: Emerging role of surface engineering

Published:2023-06 Issue: Volume:206 Page:123888
ISSN:0017-9310
Container-title:International Journal of Heat and Mass Transfer
language:en
Short-container-title:International Journal of Heat and Mass Transfer

Author:

Sarkar Sreya,Gupta Rohit,Roy Tamal,Ganguly Ranjan,Megaridis Constantine M.^ORCID

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

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