Advances in Enhanced Boiling Heat Transfer From Electronic Components
Author:
Affiliation:
1. Institute of Advanced Material Study, Kyushu University
2. Institute for Energy Utilization, National Institute of Advanced Industrial Science and Technology
Publisher
Japan Society of Mechanical Engineers
Subject
Fluid Flow and Transfer Processes,Physical and Theoretical Chemistry,Mechanical Engineering
Link
http://www.jstage.jst.go.jp/article/jsmeb/46/4/46_4_479/_pdf
Reference38 articles.
1. (1) International Roadmap Committee, International Technology Roadmap for Semiconductors, 2002 Update, http: //public.itrs.net/ (2002).
2. Thermal Management of Electronic Components with Dielectric Liquids.
3. (4) Oktay, S., Departure from Natural Convection (DNC) in Low-Temperature Boiling Heat Transfer Encountered in Cooling Micro-Electronic LSI devices, Proc. 7th lnt. Heat Transfer Conf., Vol.4 (1982), pp.113-118.
4. Effects of boiling history on a microconfigured surface in a dielectric liquid
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